Xiaomi is not idle. Work on the XRING O2 chipset is intensive, it could even get into cars or watches

  • The XRING O2 trademark has appeared in a Chinese database
  • The new chipset was reportedly successfully completed in March
  • American restrictions could reportedly complicate the deployment of 2nm manufacturing technology

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Adam Kurfürst
Adam Kurfürst
30. 6. 2025 04:30

Chinese technology giant Xiaomi is likely not idle and is already preparing the successor to its first proprietary chipset. A mention of the XRING O2 chipset, which is expected to follow the recently introduced XRING O1, has reportedly appeared on the Chinese trademark registration platform TianYanCha. The latter currently powers the flagship smartphone Xiaomi 15S Pro and the powerful tablet Xiaomi Pad 7S Pro, having managed to surpass competing solutions like Qualcomm’s Snapdragon 8 Elite or MediaTek Dimensity 9400 in benchmarks.

Ambitious Plans with State-of-the-Art Technology

As reported by TrendForce, according to leaks cited by EE Times China, the XRING O2 was successfully completed (tape-out) as early as March this year. While the current XRING O1 is manufactured using TSMC’s second-generation 3nm manufacturing process (N3B), its successor could benefit from even more advanced technologies. The new chipset is expected to utilize at least TSMC’s third-generation 3nm technology (N3P), or even the more ambitious 2nm technology.

Xiaomi Pad 7S Pro s čipem XRING O1

However, Xiaomi’s plans may be complicated by US trade restrictions. Due to restrictions on specialized tools necessary for designing modern chips, the Chinese company may not be able to use the most advanced 2nm process. In that case, it would have to settle for the TSMC N3E process, which could mean that the XRING O2 will lag behind the expected Qualcomm Snapdragon 8 Elite Gen 3 and Apple A20 in terms of performance, as these are expected to benefit from the 2nm technology.

Lingering Challenges and Innovative Approach

Despite progress in developing its own chipsets, Xiaomi still has one significant weakness – the need to rely on an external chip for mobile connectivity. The company is expected to continue using solutions from MediaTek, likely upgrading from the T800 modem to the newer T900. This dependence on an external supplier represents a certain disadvantage compared to integrated solutions from competitors.

An interesting piece of information was then provided by the well-known leaker Digital Chat Station, according to whom Xiaomi could develop a single universal chip design that would subsequently be adapted for various product categories. Modified versions of the same architecture could thus power not only smartphones but also smartwatches or automotive systems.

When Can We Expect the First Devices?

The exact timeline for the launch of the XRING O2 chipset or the products that might be equipped with it is not yet known. Given that the XRING O1 was only recently introduced with the Xiaomi 15S Pro model, it can be assumed that we will have to wait some time for its successor. However, it is clear that Xiaomi has serious ambitions to become a significant player in the field of designing its own chipsets, similar to Apple, Samsung, or Huawei.

How much are you looking forward to the further development of Xiaomi’s own chipsets?

Sources: TrendForce, Gizmochina, Digital Chat Station/Weibo

About the author

Adam Kurfürst

Adam studuje na gymnáziu a technologické žurnalistice se věnuje od svých 14 let. Pakliže pomineme jeho vášeň pro chytré telefony, tablety a příslušenství, rád se… More about the author

Adam Kurfürst
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